S29WS256P0SBFW000
vs
S29WS256POSBAW000
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
INFINEON TECHNOLOGIES AG
|
CYPRESS SEMICONDUCTOR CORP
|
Package Description |
FBGA-84
|
|
Reach Compliance Code |
compliant
|
compliant
|
Factory Lead Time |
2 Days
|
|
Samacsys Manufacturer |
Infineon
|
|
Access Time-Max |
80 ns
|
9 ns
|
Additional Feature |
SYNCHRONOUS BURST MODE OPERATION POSSIBLE
|
|
Boot Block |
BOTTOM/TOP
|
BOTTOM/TOP
|
Command User Interface |
YES
|
YES
|
Common Flash Interface |
YES
|
YES
|
Data Polling |
YES
|
YES
|
JESD-30 Code |
R-PBGA-B84
|
R-PBGA-B84
|
JESD-609 Code |
e1
|
e1
|
Length |
11.6 mm
|
|
Memory Density |
268435456 bit
|
268435456 bit
|
Memory IC Type |
FLASH
|
FLASH
|
Memory Width |
16
|
16
|
Moisture Sensitivity Level |
3
|
3
|
Number of Functions |
1
|
|
Number of Sectors/Size |
8,254
|
8,254
|
Number of Terminals |
84
|
84
|
Number of Words |
16777216 words
|
16777216 words
|
Number of Words Code |
16000000
|
16000000
|
Operating Mode |
ASYNCHRONOUS
|
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-25 °C
|
-25 °C
|
Organization |
16MX16
|
16MX16
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
FBGA
|
Package Equivalence Code |
BGA84,10X12,32
|
BGA84,10X12,32
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, FINE PITCH
|
Page Size |
8 words
|
8 words
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
260
|
|
Programming Voltage |
1.8 V
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Ready/Busy |
YES
|
YES
|
Seated Height-Max |
1 mm
|
|
Sector Size |
16K,64K
|
16K,64K
|
Standby Current-Max |
0.000005 A
|
0.000005 A
|
Supply Current-Max |
0.08 mA
|
0.08 mA
|
Supply Voltage-Max (Vsup) |
1.95 V
|
|
Supply Voltage-Min (Vsup) |
1.7 V
|
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Toggle Bit |
YES
|
YES
|
Type |
NOR TYPE
|
NOR TYPE
|
Width |
8 mm
|
|
Base Number Matches |
1
|
1
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.32.00.51
|
|
|
|
Compare S29WS256P0SBFW000 with alternatives
Compare S29WS256POSBAW000 with alternatives