S29WS128J0PBAW112
vs
S29WS128J0SBAI013
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
ADVANCED MICRO DEVICES INC
Reach Compliance Code
compliant
unknown
Access Time-Max
55 ns
Boot Block
BOTTOM/TOP
Command User Interface
YES
Common Flash Interface
YES
Data Polling
YES
JESD-30 Code
R-PBGA-B84
Memory Density
134217728 bit
Memory IC Type
FLASH
Number of Sectors/Size
16,254
Number of Terminals
84
Number of Words
8388608 words
Number of Words Code
8000000
Operating Temperature-Max
85 °C
Operating Temperature-Min
-25 °C
Organization
8MX16
Package Body Material
PLASTIC/EPOXY
Package Code
FBGA
Package Equivalence Code
BGA84,10X12,32
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, FINE PITCH
Parallel/Serial
PARALLEL
Power Supplies
1.8 V
Qualification Status
Not Qualified
Ready/Busy
YES
Sector Size
4K,32K
Standby Current-Max
0.00005 A
Supply Current-Max
0.054 mA
Supply Voltage-Nom (Vsup)
1.8 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
OTHER
Terminal Form
BALL
Terminal Pitch
0.8 mm
Terminal Position
BOTTOM
Toggle Bit
YES
Type
NOR TYPE
Base Number Matches
2
3
Package Description
,
ECCN Code
EAR99
HTS Code
8542.32.00.51