S29WS064J0SBAW000
vs
S29WS064J0PBFI013
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
CYPRESS SEMICONDUCTOR CORP
|
| Package Description |
,
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.32.00.51
|
|
| Base Number Matches |
3
|
3
|
| Rohs Code |
|
Yes
|
| Access Time-Max |
|
55 ns
|
| Boot Block |
|
BOTTOM/TOP
|
| Command User Interface |
|
YES
|
| Common Flash Interface |
|
YES
|
| Data Polling |
|
YES
|
| JESD-30 Code |
|
R-PBGA-B80
|
| Memory Density |
|
67108864 bit
|
| Memory IC Type |
|
FLASH
|
| Number of Sectors/Size |
|
16,126
|
| Number of Terminals |
|
80
|
| Number of Words |
|
4194304 words
|
| Number of Words Code |
|
4000000
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
|
4MX16
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
FBGA
|
| Package Equivalence Code |
|
BGA80,8X10,32
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
GRID ARRAY, FINE PITCH
|
| Parallel/Serial |
|
PARALLEL
|
| Power Supplies |
|
1.8 V
|
| Qualification Status |
|
Not Qualified
|
| Ready/Busy |
|
YES
|
| Sector Size |
|
4K,32K
|
| Standby Current-Max |
|
0.00005 A
|
| Supply Current-Max |
|
0.054 mA
|
| Supply Voltage-Nom (Vsup) |
|
1.8 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
0.8 mm
|
| Terminal Position |
|
BOTTOM
|
| Toggle Bit |
|
YES
|
| Type |
|
NOR TYPE
|
|
|
|