S29WS064J0PBAI013
vs
S29WS064J0SBFW003
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
ADVANCED MICRO DEVICES INC
Reach Compliance Code
compliant
unknown
Access Time-Max
55 ns
Boot Block
BOTTOM/TOP
Command User Interface
YES
Common Flash Interface
YES
Data Polling
YES
JESD-30 Code
R-PBGA-B80
Memory Density
67108864 bit
Memory IC Type
FLASH
Number of Sectors/Size
16,126
Number of Terminals
80
Number of Words
4194304 words
Number of Words Code
4000000
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
4MX16
Package Body Material
PLASTIC/EPOXY
Package Code
FBGA
Package Equivalence Code
BGA80,8X10,32
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, FINE PITCH
Parallel/Serial
PARALLEL
Power Supplies
1.8 V
Qualification Status
Not Qualified
Ready/Busy
YES
Sector Size
4K,32K
Standby Current-Max
0.00005 A
Supply Current-Max
0.054 mA
Supply Voltage-Nom (Vsup)
1.8 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Form
BALL
Terminal Pitch
0.8 mm
Terminal Position
BOTTOM
Toggle Bit
YES
Type
NOR TYPE
Base Number Matches
3
3
Package Description
,
ECCN Code
EAR99
HTS Code
8542.32.00.51