S29WS064J0PBAI003 vs S29WS064J0SBFW01 feature comparison

S29WS064J0PBAI003 AMD

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S29WS064J0SBFW01 Spansion

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC SPANSION INC
Package Description , 7 X 9 MM, LEAD FREE, FBGA-80
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Base Number Matches 3 3
Rohs Code Yes
Part Package Code BGA
Pin Count 80
Access Time-Max 55 ns
Additional Feature SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
Boot Block BOTTOM/TOP
Command User Interface YES
Common Flash Interface YES
Data Polling YES
JESD-30 Code R-PBGA-B80
JESD-609 Code e1
Length 9 mm
Memory Density 67108864 bit
Memory IC Type FLASH
Memory Width 16
Moisture Sensitivity Level 3
Number of Functions 1
Number of Sectors/Size 16,126
Number of Terminals 80
Number of Words 4194304 words
Number of Words Code 4000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -25 °C
Organization 4MX16
Package Body Material PLASTIC/EPOXY
Package Code VFBGA
Package Equivalence Code BGA80,8X10,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Programming Voltage 1.8 V
Qualification Status Not Qualified
Ready/Busy YES
Seated Height-Max 1 mm
Sector Size 4K,32K
Standby Current-Max 0.00005 A
Supply Current-Max 0.06 mA
Supply Voltage-Max (Vsup) 1.95 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Toggle Bit YES
Type NOR TYPE
Width 7 mm

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