S29VS128R0SBHW003 vs S29XS128RABBHW13 feature comparison

S29VS128R0SBHW003 Spansion

Buy Now Datasheet

S29XS128RABBHW13 Spansion

Buy Now Datasheet
Rohs Code Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer SPANSION INC SPANSION INC
Part Package Code BGA BGA
Package Description 7.70 X 6.20 MM, 1 MM HEIGHT, HALOGEN FREE AND LEAD FREE, FBGA-44 VFBGA,
Pin Count 44 44
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 80 ns 80 ns
Additional Feature TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
Boot Block TOP BOTTOM
JESD-30 Code R-PBGA-B44 R-PBGA-B44
Length 7.7 mm 7.7 mm
Memory Density 134217728 bit 134217728 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 44 44
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -25 °C
Organization 8MX16 8MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA VFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260
Programming Voltage 1.8 V 1.8 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 1 mm
Supply Voltage-Max (Vsup) 1.95 V 1.95 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Form BALL BALL
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Type NOR TYPE
Width 6.2 mm 6.2 mm
Base Number Matches 2 2

Compare S29VS128R0SBHW003 with alternatives