S29PL32J55BFW12 vs S29PL032J55BFI12 feature comparison

S29PL32J55BFW12 Cypress Semiconductor

Buy Now Datasheet

S29PL032J55BFI12 AMD

Buy Now Datasheet
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP ADVANCED MICRO DEVICES INC
Package Description VFBGA, ,
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 55 ns
Boot Block BOTTOM/TOP
JESD-30 Code R-PBGA-B48
Length 8.15 mm
Memory Density 33554432 bit
Memory IC Type FLASH
Memory Width 16
Number of Functions 1
Number of Terminals 48
Number of Words 2097152 words
Number of Words Code 2000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -25 °C
Organization 2MX16
Package Body Material PLASTIC/EPOXY
Package Code VFBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL
Programming Voltage 3 V
Qualification Status Not Qualified
Seated Height-Max 1 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Type NOR TYPE
Width 6.15 mm
Base Number Matches 2 3

Compare S29PL32J55BFW12 with alternatives