S29PL129N70GAW003
vs
S29PL127J70BFI023
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
SPANSION INC
ADVANCED MICRO DEVICES INC
Part Package Code
BGA
Package Description
8 X 11.60 MM, LEAD FREE COMPLIANT, FBGA-64
,
Pin Count
64
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
70 ns
JESD-30 Code
R-PBGA-B64
JESD-609 Code
e0
Length
11.6 mm
Memory Density
134217728 bit
Memory IC Type
FLASH
Memory Width
16
Moisture Sensitivity Level
3
Number of Functions
1
Number of Terminals
64
Number of Words
8388608 words
Number of Words Code
8000000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-25 °C
Organization
8MX16
Package Body Material
PLASTIC/EPOXY
Package Code
VFBGA
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
Programming Voltage
3 V
Qualification Status
Not Qualified
Seated Height-Max
1 mm
Supply Voltage-Max (Vsup)
3.1 V
Supply Voltage-Min (Vsup)
2.7 V
Supply Voltage-Nom (Vsup)
3 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
OTHER
Terminal Finish
TIN LEAD
Terminal Form
BALL
Terminal Pitch
0.8 mm
Terminal Position
BOTTOM
Type
NOR TYPE
Width
8 mm
Base Number Matches
2
3
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