S29PL129J70BAW001 vs S29PL129J70BAF002 feature comparison

S29PL129J70BAW001 AMD

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S29PL129J70BAF002 Spansion

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC SPANSION INC
Package Description , VFBGA,
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Base Number Matches 3 1
Part Package Code BGA
Pin Count 80
Access Time-Max 70 ns
Boot Block BOTTOM/TOP
JESD-30 Code R-PBGA-B80
Length 11 mm
Memory Density 134217728 bit
Memory IC Type FLASH
Memory Width 16
Number of Functions 1
Number of Terminals 80
Number of Words 8388608 words
Number of Words Code 8000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 8MX16
Package Body Material PLASTIC/EPOXY
Package Code VFBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programming Voltage 3 V
Qualification Status Not Qualified
Seated Height-Max 1 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Type NOR TYPE
Width 8 mm

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