S29PL127N70GAWW00
vs
S29PL129N70GFWW02
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
CYPRESS SEMICONDUCTOR CORP
|
| Package Description |
8 X 11.60 MM, LEAD FREE, FBGA-84
|
8 X 11.60 MM, LEAD FREE, FBGA-84
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Access Time-Max |
70 ns
|
70 ns
|
| Boot Block |
BOTTOM/TOP
|
BOTTOM/TOP
|
| Command User Interface |
YES
|
YES
|
| Common Flash Interface |
YES
|
YES
|
| Data Polling |
YES
|
YES
|
| JESD-30 Code |
R-PBGA-B64
|
R-PBGA-B64
|
| Length |
11.6 mm
|
11.6 mm
|
| Memory Density |
134217728 bit
|
134217728 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Sectors/Size |
8,62
|
8,62
|
| Number of Terminals |
64
|
64
|
| Number of Words |
8388608 words
|
8388608 words
|
| Number of Words Code |
8000000
|
8000000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-25 °C
|
-25 °C
|
| Organization |
8MX16
|
8MX16
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
VFBGA
|
| Package Equivalence Code |
BGA64,10X12,32
|
BGA64,10X12,32
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Page Size |
8 words
|
8 words
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Programming Voltage |
3 V
|
3 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Ready/Busy |
YES
|
YES
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Sector Size |
32K,128K
|
32K,128K
|
| Standby Current-Max |
0.00004 A
|
0.00004 A
|
| Supply Current-Max |
0.055 mA
|
0.055 mA
|
| Supply Voltage-Max (Vsup) |
3.1 V
|
3.1 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
COMMERCIAL EXTENDED
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
40
|
| Toggle Bit |
YES
|
YES
|
| Type |
NOR TYPE
|
NOR TYPE
|
| Width |
8 mm
|
8 mm
|
| Base Number Matches |
2
|
2
|
| JESD-609 Code |
|
e1
|
| Moisture Sensitivity Level |
|
3
|
| Terminal Finish |
|
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
|
|
|
|
Compare S29PL127N70GAWW00 with alternatives
Compare S29PL129N70GFWW02 with alternatives