S29PL127J70TFW130
vs
S29PL127J70TFW002
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
CYPRESS SEMICONDUCTOR CORP
Package Description
,
FBGA-80
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Base Number Matches
3
2
Rohs Code
Access Time-Max
70 ns
Additional Feature
TOP AND BOTTOM BOOT BLOCK
Boot Block
BOTTOM/TOP
Command User Interface
YES
Common Flash Interface
YES
Data Polling
YES
JESD-30 Code
R-PBGA-B80
JESD-609 Code
e1
Length
11 mm
Memory Density
134217728 bit
Memory IC Type
FLASH
Memory Width
16
Moisture Sensitivity Level
3
Number of Functions
1
Number of Sectors/Size
16,254
Number of Terminals
80
Number of Words
8388608 words
Number of Words Code
8000000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-25 °C
Organization
8MX16
Package Body Material
PLASTIC/EPOXY
Package Code
VFBGA
Package Equivalence Code
TSSOP56,.8,20
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Page Size
8 words
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
260
Programming Voltage
3 V
Qualification Status
Not Qualified
Ready/Busy
YES
Seated Height-Max
1 mm
Sector Size
4K,32K
Standby Current-Max
0.000005 A
Supply Current-Max
0.07 mA
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
Supply Voltage-Nom (Vsup)
3 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
OTHER
Terminal Finish
TIN SILVER COPPER
Terminal Form
BALL
Terminal Pitch
0.8 mm
Terminal Position
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Toggle Bit
YES
Type
NOR TYPE
Width
8 mm
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