S29PL127J70BFW133 vs S29PL127J70BAW130 feature comparison

S29PL127J70BFW133 Spansion

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S29PL127J70BAW130 Spansion

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Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer SPANSION INC SPANSION INC
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 70 ns 70 ns
Boot Block BOTTOM/TOP BOTTOM/TOP
Command User Interface YES YES
Common Flash Interface YES YES
Data Polling YES YES
JESD-30 Code R-PBGA-B80 R-PBGA-B80
JESD-609 Code e3 e0
Memory Density 134217728 bit 134217728 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Moisture Sensitivity Level 3 3
Number of Sectors/Size 16,254 16,254
Number of Terminals 80 80
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -25 °C
Organization 8MX16 8MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FBGA FBGA
Package Equivalence Code BGA80,8X12,32 BGA80,8X12,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH
Page Size 8 words 8 words
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 260
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Ready/Busy YES YES
Sector Size 4K,32K 4K,32K
Standby Current-Max 0.000005 A 0.000005 A
Supply Current-Max 0.07 mA 0.07 mA
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish MATTE TIN TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Toggle Bit YES YES
Type NOR TYPE NOR TYPE
Base Number Matches 2 2

Compare S29PL127J70BFW133 with alternatives

Compare S29PL127J70BAW130 with alternatives