S29PL127J70BAW012
vs
S29PL127J70BAW131
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
SPANSION INC
|
| Package Description |
,
|
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Base Number Matches |
3
|
2
|
| Rohs Code |
|
No
|
| Access Time-Max |
|
70 ns
|
| Boot Block |
|
BOTTOM/TOP
|
| Command User Interface |
|
YES
|
| Common Flash Interface |
|
YES
|
| Data Polling |
|
YES
|
| JESD-30 Code |
|
R-PBGA-B80
|
| JESD-609 Code |
|
e0
|
| Memory Density |
|
134217728 bit
|
| Memory IC Type |
|
FLASH
|
| Memory Width |
|
16
|
| Moisture Sensitivity Level |
|
3
|
| Number of Sectors/Size |
|
16,254
|
| Number of Terminals |
|
80
|
| Number of Words |
|
8388608 words
|
| Number of Words Code |
|
8000000
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-25 °C
|
| Organization |
|
8MX16
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
FBGA
|
| Package Equivalence Code |
|
BGA80,8X12,32
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
GRID ARRAY, FINE PITCH
|
| Page Size |
|
8 words
|
| Parallel/Serial |
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Programming Voltage |
|
3 V
|
| Qualification Status |
|
Not Qualified
|
| Ready/Busy |
|
YES
|
| Sector Size |
|
4K,32K
|
| Standby Current-Max |
|
0.000005 A
|
| Supply Current-Max |
|
0.07 mA
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
OTHER
|
| Terminal Finish |
|
TIN LEAD
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
0.8 mm
|
| Terminal Position |
|
BOTTOM
|
| Toggle Bit |
|
YES
|
| Type |
|
NOR TYPE
|
|
|
|
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