S29PL127J70BAI132
vs
S29PL127J70BFI001
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
SPANSION INC
|
ADVANCED MICRO DEVICES INC
|
Reach Compliance Code |
not_compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Access Time-Max |
70 ns
|
|
Boot Block |
BOTTOM/TOP
|
|
Command User Interface |
YES
|
|
Common Flash Interface |
YES
|
|
Data Polling |
YES
|
|
JESD-30 Code |
R-PBGA-B80
|
|
JESD-609 Code |
e0
|
|
Memory Density |
134217728 bit
|
|
Memory IC Type |
FLASH
|
|
Memory Width |
16
|
|
Moisture Sensitivity Level |
3
|
|
Number of Sectors/Size |
16,254
|
|
Number of Terminals |
80
|
|
Number of Words |
8388608 words
|
|
Number of Words Code |
8000000
|
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
8MX16
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
FBGA
|
|
Package Equivalence Code |
BGA80,8X12,32
|
|
Package Shape |
RECTANGULAR
|
|
Package Style |
GRID ARRAY, FINE PITCH
|
|
Page Size |
8 words
|
|
Parallel/Serial |
PARALLEL
|
|
Peak Reflow Temperature (Cel) |
260
|
|
Programming Voltage |
3 V
|
|
Qualification Status |
Not Qualified
|
|
Ready/Busy |
YES
|
|
Sector Size |
4K,32K
|
|
Standby Current-Max |
0.000005 A
|
|
Supply Current-Max |
0.07 mA
|
|
Surface Mount |
YES
|
|
Technology |
CMOS
|
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
BALL
|
|
Terminal Pitch |
0.8 mm
|
|
Terminal Position |
BOTTOM
|
|
Toggle Bit |
YES
|
|
Type |
NOR TYPE
|
|
Base Number Matches |
2
|
3
|
Package Description |
|
,
|
|
|
|
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