S29PL127J70BAI023
vs
S29PL127N70GAI003
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
SPANSION INC
Package Description
,
8 X 11.60 MM, LEAD FREE COMPLIANT, FBGA-64
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Base Number Matches
3
1
Pbfree Code
Rohs Code
Part Package Code
BGA
Pin Count
64
Access Time-Max
70 ns
JESD-30 Code
R-PBGA-B64
JESD-609 Code
e0
Length
11.6 mm
Memory Density
134217728 bit
Memory IC Type
FLASH
Memory Width
16
Moisture Sensitivity Level
3
Number of Functions
1
Number of Terminals
64
Number of Words
8388608 words
Number of Words Code
8000000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
8MX16
Package Body Material
PLASTIC/EPOXY
Package Code
VFBGA
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
Programming Voltage
3 V
Qualification Status
Not Qualified
Seated Height-Max
1 mm
Supply Voltage-Max (Vsup)
3.1 V
Supply Voltage-Min (Vsup)
2.7 V
Supply Voltage-Nom (Vsup)
3 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
BALL
Terminal Pitch
0.8 mm
Terminal Position
BOTTOM
Type
NOR TYPE
Width
8 mm
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