S29PL127J65BFW130
vs
S29PL127J65BFW010
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
SPANSION INC
|
ADVANCED MICRO DEVICES INC
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Access Time-Max |
65 ns
|
|
| Boot Block |
BOTTOM/TOP
|
|
| Command User Interface |
YES
|
|
| Common Flash Interface |
YES
|
|
| Data Polling |
YES
|
|
| JESD-30 Code |
R-PBGA-B80
|
|
| JESD-609 Code |
e3
|
|
| Memory Density |
134217728 bit
|
|
| Memory IC Type |
FLASH
|
|
| Memory Width |
16
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of Sectors/Size |
16,254
|
|
| Number of Terminals |
80
|
|
| Number of Words |
8388608 words
|
|
| Number of Words Code |
8000000
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-25 °C
|
|
| Organization |
8MX16
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
FBGA
|
|
| Package Equivalence Code |
BGA80,8X12,32
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
GRID ARRAY, FINE PITCH
|
|
| Page Size |
8 words
|
|
| Parallel/Serial |
PARALLEL
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Programming Voltage |
3 V
|
|
| Qualification Status |
Not Qualified
|
|
| Ready/Busy |
YES
|
|
| Sector Size |
4K,32K
|
|
| Standby Current-Max |
0.000005 A
|
|
| Supply Current-Max |
0.07 mA
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
OTHER
|
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
0.8 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Toggle Bit |
YES
|
|
| Type |
NOR TYPE
|
|
| Base Number Matches |
2
|
3
|
| Package Description |
|
,
|
|
|
|
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