S29PL127J65BFI000
vs
S29PL127J65BAI133
feature comparison
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
SPANSION INC
|
Package Description |
,
|
|
Reach Compliance Code |
unknown
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Base Number Matches |
3
|
2
|
Rohs Code |
|
No
|
Access Time-Max |
|
65 ns
|
Boot Block |
|
BOTTOM/TOP
|
Command User Interface |
|
YES
|
Common Flash Interface |
|
YES
|
Data Polling |
|
YES
|
JESD-30 Code |
|
R-PBGA-B80
|
JESD-609 Code |
|
e0
|
Memory Density |
|
134217728 bit
|
Memory IC Type |
|
FLASH
|
Memory Width |
|
16
|
Moisture Sensitivity Level |
|
3
|
Number of Sectors/Size |
|
16,254
|
Number of Terminals |
|
80
|
Number of Words |
|
8388608 words
|
Number of Words Code |
|
8000000
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
|
8MX16
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
FBGA
|
Package Equivalence Code |
|
BGA80,8X12,32
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
GRID ARRAY, FINE PITCH
|
Page Size |
|
8 words
|
Parallel/Serial |
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
|
260
|
Programming Voltage |
|
3 V
|
Qualification Status |
|
Not Qualified
|
Ready/Busy |
|
YES
|
Sector Size |
|
4K,32K
|
Standby Current-Max |
|
0.000005 A
|
Supply Current-Max |
|
0.07 mA
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Finish |
|
TIN LEAD
|
Terminal Form |
|
BALL
|
Terminal Pitch |
|
0.8 mm
|
Terminal Position |
|
BOTTOM
|
Toggle Bit |
|
YES
|
Type |
|
NOR TYPE
|
|
|
|
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