S29PL064J55BAI130
vs
S29PL064J55BAI15
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
SPANSION INC
Package Description
,
TFBGA, BGA56,8X8,32
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Base Number Matches
3
3
Pbfree Code
Rohs Code
Part Package Code
BGA
Pin Count
56
Access Time-Max
55 ns
Boot Block
BOTTOM/TOP
Command User Interface
YES
Common Flash Interface
YES
Data Polling
YES
JESD-30 Code
R-PBGA-B56
JESD-609 Code
e1
Length
9 mm
Memory Density
67108864 bit
Memory IC Type
FLASH
Memory Width
16
Moisture Sensitivity Level
3
Number of Functions
1
Number of Sectors/Size
16,126
Number of Terminals
56
Number of Words
4194304 words
Number of Words Code
4000000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
4MX16
Package Body Material
PLASTIC/EPOXY
Package Code
TFBGA
Package Equivalence Code
BGA56,8X8,32
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
Page Size
8 words
Parallel/Serial
PARALLEL
Programming Voltage
3 V
Qualification Status
Not Qualified
Ready/Busy
YES
Seated Height-Max
1.2 mm
Sector Size
4K,32K
Standby Current-Max
0.000005 A
Supply Current-Max
0.07 mA
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
Supply Voltage-Nom (Vsup)
3 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
Terminal Form
BALL
Terminal Pitch
0.8 mm
Terminal Position
BOTTOM
Toggle Bit
YES
Type
NOR TYPE
Width
7 mm
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