S29PL032J70BFW13 vs S29PL032J70BAW130 feature comparison

S29PL032J70BFW13 Spansion

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S29PL032J70BAW130 Cypress Semiconductor

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer SPANSION INC CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA
Package Description 7 X 9 MM, FBGA-56 7 X 9 MM, LEAD FREE COMPLIANT, FBGA-56
Pin Count 56
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 70 ns 70 ns
Boot Block BOTTOM/TOP BOTTOM/TOP
JESD-30 Code R-PBGA-B56 R-PBGA-B56
JESD-609 Code e1 e3
Length 8.95 mm
Memory Density 33554432 bit 33554432 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 56 56
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -25 °C
Organization 2MX16 2MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN SILVER COPPER MATTE TIN
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Type NOR TYPE NOR TYPE
Width 7.95 mm
Base Number Matches 1 1
Command User Interface YES
Common Flash Interface YES
Data Polling YES
Moisture Sensitivity Level 3
Number of Sectors/Size 16,62
Package Equivalence Code BGA56,8X8,32
Page Size 8 words
Ready/Busy YES
Sector Size 4K,32K
Standby Current-Max 0.000005 A
Supply Current-Max 0.07 mA
Toggle Bit YES

Compare S29PL032J70BFW13 with alternatives

Compare S29PL032J70BAW130 with alternatives