S29PL032J70BAI121 vs S29PL032J70BFI121 feature comparison

S29PL032J70BAI121 Spansion

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S29PL032J70BFI121 AMD

Buy Now Datasheet
Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer SPANSION INC ADVANCED MICRO DEVICES INC
Part Package Code BGA
Package Description 8.15 X 6.15 MM, LEAD FREE COMPLIANT, FBGA-48 ,
Pin Count 48
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 70 ns
Additional Feature TOP AND BOTTOM BOOT BLOCK
Boot Block BOTTOM/TOP
Command User Interface YES
Common Flash Interface YES
Data Polling YES
JESD-30 Code R-PBGA-B48
JESD-609 Code e0
Length 8.15 mm
Memory Density 33554432 bit
Memory IC Type FLASH
Memory Width 16
Moisture Sensitivity Level 3
Number of Functions 1
Number of Sectors/Size 16,62
Number of Terminals 48
Number of Words 2097152 words
Number of Words Code 2000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 2MX16
Package Body Material PLASTIC/EPOXY
Package Code VFBGA
Package Equivalence Code BGA48,6X8,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Page Size 8 words
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Programming Voltage 3 V
Qualification Status Not Qualified
Ready/Busy YES
Seated Height-Max 1 mm
Sector Size 4K,32K
Standby Current-Max 0.000005 A
Supply Current-Max 0.07 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Toggle Bit YES
Type NOR TYPE
Width 6.15 mm
Base Number Matches 3 3

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