S29PL032J60BFW123
vs
K8P3315UQB-DE4B
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
SAMSUNG SEMICONDUCTOR INC
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Base Number Matches
3
1
Part Package Code
BGA
Package Description
VFBGA,
Pin Count
48
Access Time-Max
60 ns
Additional Feature
TOP AND BOTTOM BOOT BLOCK
Boot Block
BOTTOM/TOP
JESD-30 Code
R-PBGA-B48
Length
8 mm
Memory Density
33554432 bit
Memory IC Type
FLASH
Memory Width
16
Number of Functions
1
Number of Terminals
48
Number of Words
2097152 words
Number of Words Code
2000000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-25 °C
Organization
2MX16
Package Body Material
PLASTIC/EPOXY
Package Code
VFBGA
Package Shape
RECTANGULAR
Package Style
GRID ARRAY
Parallel/Serial
PARALLEL
Programming Voltage
3 V
Qualification Status
Not Qualified
Seated Height-Max
1 mm
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
Supply Voltage-Nom (Vsup)
3 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
OTHER
Terminal Form
BALL
Terminal Pitch
0.8 mm
Terminal Position
BOTTOM
Width
6 mm
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