S29PL032J60BAW12
vs
K8P3315UQB-DC4B
feature comparison
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
SAMSUNG SEMICONDUCTOR INC
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Base Number Matches |
3
|
1
|
Part Package Code |
|
BGA
|
Package Description |
|
VFBGA,
|
Pin Count |
|
48
|
Access Time-Max |
|
60 ns
|
Additional Feature |
|
TOP AND BOTTOM BOOT BLOCK
|
Boot Block |
|
BOTTOM/TOP
|
JESD-30 Code |
|
R-PBGA-B48
|
Length |
|
8 mm
|
Memory Density |
|
33554432 bit
|
Memory IC Type |
|
FLASH
|
Memory Width |
|
16
|
Number of Functions |
|
1
|
Number of Terminals |
|
48
|
Number of Words |
|
2097152 words
|
Number of Words Code |
|
2000000
|
Operating Mode |
|
SYNCHRONOUS
|
Operating Temperature-Max |
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
|
2MX16
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
VFBGA
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
GRID ARRAY
|
Parallel/Serial |
|
PARALLEL
|
Programming Voltage |
|
3 V
|
Qualification Status |
|
Not Qualified
|
Seated Height-Max |
|
1 mm
|
Supply Voltage-Max (Vsup) |
|
3.6 V
|
Supply Voltage-Min (Vsup) |
|
2.7 V
|
Supply Voltage-Nom (Vsup) |
|
3 V
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
COMMERCIAL
|
Terminal Form |
|
BALL
|
Terminal Pitch |
|
0.8 mm
|
Terminal Position |
|
BOTTOM
|
Width |
|
6 mm
|
|
|
|
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