S29PL032J55BFW15
vs
S29PL032J55BAW133
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
CYPRESS SEMICONDUCTOR CORP
|
| Package Description |
TFBGA, BGA56,8X8,32
|
7 X 9 MM, LEAD FREE COMPLIANT, FBGA-56
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Access Time-Max |
55 ns
|
55 ns
|
| Boot Block |
BOTTOM/TOP
|
BOTTOM/TOP
|
| Command User Interface |
YES
|
YES
|
| Common Flash Interface |
YES
|
YES
|
| Data Polling |
YES
|
YES
|
| JESD-30 Code |
R-PBGA-B56
|
R-PBGA-B56
|
| JESD-609 Code |
e1
|
e3
|
| Length |
9 mm
|
|
| Memory Density |
33554432 bit
|
33554432 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
16
|
16
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
1
|
| Number of Sectors/Size |
16,62
|
16,62
|
| Number of Terminals |
56
|
56
|
| Number of Words |
2097152 words
|
2097152 words
|
| Number of Words Code |
2000000
|
2000000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-25 °C
|
-25 °C
|
| Organization |
2MX16
|
2MX16
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFBGA
|
BGA
|
| Package Equivalence Code |
BGA56,8X8,32
|
BGA56,8X8,32
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY
|
| Page Size |
8 words
|
8 words
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Programming Voltage |
3 V
|
3 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Ready/Busy |
YES
|
YES
|
| Seated Height-Max |
1.2 mm
|
|
| Sector Size |
4K,32K
|
4K,32K
|
| Standby Current-Max |
0.000005 A
|
0.000005 A
|
| Supply Current-Max |
0.07 mA
|
0.07 mA
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
|
MATTE TIN
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Toggle Bit |
YES
|
YES
|
| Type |
NOR TYPE
|
NOR TYPE
|
| Width |
7 mm
|
|
| Base Number Matches |
3
|
3
|
|
|
|
Compare S29PL032J55BFW15 with alternatives
Compare S29PL032J55BAW133 with alternatives