S29PL032J55BAW12
vs
S29PL032J55BAW122
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
ADVANCED MICRO DEVICES INC
Package Description
8.15 X 6.15 MM, FBGA-48
,
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
55 ns
Boot Block
BOTTOM/TOP
Command User Interface
YES
Common Flash Interface
YES
Data Polling
YES
JESD-30 Code
R-PBGA-B48
JESD-609 Code
e0
Length
8.15 mm
Memory Density
33554432 bit
Memory IC Type
FLASH
Memory Width
16
Moisture Sensitivity Level
3
Number of Functions
1
Number of Sectors/Size
16,62
Number of Terminals
48
Number of Words
2097152 words
Number of Words Code
2000000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-25 °C
Organization
2MX16
Package Body Material
PLASTIC/EPOXY
Package Code
VFBGA
Package Equivalence Code
BGA48,6X8,32
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Page Size
8 words
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
260
Programming Voltage
3 V
Qualification Status
Not Qualified
Ready/Busy
YES
Seated Height-Max
1 mm
Sector Size
4K,32K
Standby Current-Max
0.000005 A
Supply Current-Max
0.07 mA
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
Supply Voltage-Nom (Vsup)
3 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
OTHER
Terminal Finish
TIN LEAD
Terminal Form
BALL
Terminal Pitch
0.8 mm
Terminal Position
BOTTOM
Toggle Bit
YES
Type
NOR TYPE
Width
6.15 mm
Base Number Matches
3
3
Compare S29PL032J55BAW12 with alternatives