S29JL064H90BAI002
vs
AM29DL640G90WHI
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
SPANSION INC
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
90 ns
90 ns
Alternate Memory Width
8
8
Boot Block
BOTTOM/TOP
BOTTOM/TOP
Command User Interface
YES
YES
Common Flash Interface
YES
YES
Data Polling
YES
YES
JESD-30 Code
R-PBGA-B63
R-PBGA-B63
JESD-609 Code
e0
e0
Memory Density
67108864 bit
67108864 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Sectors/Size
16,126
16,126
Number of Terminals
63
63
Number of Words
4194304 words
4194304 words
Number of Words Code
4000000
4000000
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
4MX16
4MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FBGA
TFBGA
Package Equivalence Code
BGA63,8X12,32
BGA63,8X12,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Ready/Busy
YES
YES
Sector Size
8K,64K
8K,64K
Standby Current-Max
0.000005 A
0.000005 A
Supply Current-Max
0.045 mA
0.045 mA
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Toggle Bit
YES
YES
Type
NOR TYPE
NOR TYPE
Base Number Matches
2
2
Part Package Code
BGA
Package Description
12 X 11 MM, 0.80 MM PITCH, FBGA-63
Pin Count
63
Length
12 mm
Moisture Sensitivity Level
3
Number of Functions
1
Operating Mode
ASYNCHRONOUS
Peak Reflow Temperature (Cel)
260
Programming Voltage
3 V
Seated Height-Max
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
Supply Voltage-Nom (Vsup)
3 V
Width
11 mm
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