S29GL512S11FAI013 vs S29GL512S10DHI020 feature comparison

S29GL512S11FAI013 Cypress Semiconductor

Buy Now Datasheet

S29GL512S10DHI020 Spansion

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP SPANSION INC
Package Description FBGA-64 LEAD FREE, PACKAGE
Reach Compliance Code compliant compliant
ECCN Code EAR99 3A991.B.1.A
HTS Code 8542.32.00.51 8542.32.00.51
JESD-30 Code R-PBGA-B64 S-PBGA-B64
Memory Density 536870912 bit 536870912 bit
Memory IC Type FLASH FLASH
Memory Width 1 8
Number of Functions 1 1
Number of Terminals 64 64
Number of Words 536870912 words 67108864 words
Number of Words Code 512000000 64000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 512MX1 64MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Shape RECTANGULAR SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Programming Voltage 3 V 2.7 V
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
Base Number Matches 2 3
Part Package Code BGA
Pin Count 64
Access Time-Max 100 ns
Command User Interface YES
Common Flash Interface YES
Data Polling YES
JESD-609 Code e1
Length 9 mm
Moisture Sensitivity Level 3
Number of Sectors/Size 512
Package Equivalence Code BGA64,8X8,40
Page Size 16 words
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Ready/Busy YES
Seated Height-Max 1.4 mm
Sector Size 64K
Standby Current-Max 0.0001 A
Supply Current-Max 0.08 mA
Terminal Finish TIN SILVER COPPER
Terminal Pitch 1 mm
Time@Peak Reflow Temperature-Max (s) 40
Toggle Bit YES
Type NOR TYPE
Width 9 mm

Compare S29GL512S11FAI013 with alternatives

Compare S29GL512S10DHI020 with alternatives