S29GL512P13FAIV12
vs
S29NS512PABBJW003
feature comparison
Pbfree Code |
No
|
Yes
|
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
SPANSION INC
|
SPANSION INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
LBGA,
|
8 X 9.20 MM, LEAD FREE, TFBGA-64
|
Pin Count |
64
|
64
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Access Time-Max |
110 ns
|
80 ns
|
Alternate Memory Width |
8
|
|
JESD-30 Code |
R-PBGA-B64
|
R-PBGA-B64
|
JESD-609 Code |
e0
|
e1
|
Length |
13 mm
|
9.2 mm
|
Memory Density |
536870912 bit
|
536870912 bit
|
Memory IC Type |
FLASH
|
FLASH
|
Memory Width |
16
|
16
|
Moisture Sensitivity Level |
3
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
64
|
64
|
Number of Words |
33554432 words
|
33554432 words
|
Number of Words Code |
32000000
|
32000000
|
Operating Mode |
ASYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-25 °C
|
Organization |
32MX16
|
32MX16
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
VFBGA
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Programming Voltage |
3 V
|
1.8 V
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.4 mm
|
1 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
1.95 V
|
Supply Voltage-Min (Vsup) |
2.7 V
|
1.7 V
|
Supply Voltage-Nom (Vsup) |
3 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL EXTENDED
|
Terminal Finish |
TIN LEAD
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Type |
NOR TYPE
|
NOR TYPE
|
Width |
11 mm
|
8 mm
|
Base Number Matches |
1
|
1
|
Boot Block |
|
BOTTOM/TOP
|
Command User Interface |
|
YES
|
Common Flash Interface |
|
YES
|
Data Polling |
|
YES
|
Number of Sectors/Size |
|
512
|
Package Equivalence Code |
|
BGA64,8X14,20
|
Peak Reflow Temperature (Cel) |
|
260
|
Sector Size |
|
64K
|
Standby Current-Max |
|
0.00007 A
|
Supply Current-Max |
|
0.08 mA
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
Toggle Bit |
|
YES
|
|
|
|
Compare S29GL512P13FAIV12 with alternatives
Compare S29NS512PABBJW003 with alternatives