S29GL512P11TAI010
vs
S29GL512P11TFI013
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
CYPRESS SEMICONDUCTOR CORP
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
110 ns
110 ns
Alternate Memory Width
8
1
Command User Interface
YES
YES
Common Flash Interface
YES
YES
Data Polling
YES
YES
JESD-30 Code
R-PDSO-G56
R-PDSO-G56
Memory Density
536870912 bit
536870912 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
8
Number of Sectors/Size
512
512
Number of Terminals
56
56
Number of Words
33554432 words
67108864 words
Number of Words Code
32000000
64000000
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
32MX16
64MX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
HTSSOP
Package Equivalence Code
TSSOP56,.8,20
TSSOP56,.8,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
Page Size
8/16 words
8/16 words
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Ready/Busy
YES
YES
Sector Size
128K
128K
Standby Current-Max
0.000005 A
0.000005 A
Supply Current-Max
0.08 mA
0.11 mA
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Toggle Bit
YES
YES
Type
NOR TYPE
NOR TYPE
Base Number Matches
3
3
Package Description
TSOP-56
Boot Block
BOTTOM/TOP
JESD-609 Code
e3
Length
18.4 mm
Moisture Sensitivity Level
3
Number of Functions
1
Operating Mode
ASYNCHRONOUS
Peak Reflow Temperature (Cel)
260
Programming Voltage
3 V
Seated Height-Max
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
Supply Voltage-Nom (Vsup)
3 V
Terminal Finish
MATTE TIN
Time@Peak Reflow Temperature-Max (s)
40
Width
14 mm
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