S29GL512P11FACR22
vs
S29GL512P11TAIV20
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
SPANSION INC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
BGA
Package Description
LBGA,
HTSSOP, TSSOP56,.8,20
Pin Count
64
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
110 ns
110 ns
JESD-30 Code
R-PBGA-B64
R-PDSO-G56
Length
13 mm
18.4 mm
Memory Density
536870912 bit
536870912 bit
Memory IC Type
FLASH
FLASH
Memory Width
1
8
Number of Functions
1
1
Number of Terminals
64
56
Number of Words
536870912 words
67108864 words
Number of Words Code
512000000
64000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
512MX1
64MX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
HTSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3 V
3 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
2.7 V
Supply Voltage-Nom (Vsup)
3.3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
INDUSTRIAL
Terminal Form
BALL
GULL WING
Terminal Pitch
1 mm
0.5 mm
Terminal Position
BOTTOM
DUAL
Type
NOR TYPE
NOR TYPE
Width
11 mm
14 mm
Base Number Matches
2
3
Rohs Code
Alternate Memory Width
1
Command User Interface
YES
Common Flash Interface
YES
Data Polling
YES
JESD-609 Code
e0
Moisture Sensitivity Level
3
Number of Sectors/Size
512
Package Equivalence Code
TSSOP56,.8,20
Page Size
8/16 words
Peak Reflow Temperature (Cel)
260
Ready/Busy
YES
Sector Size
128K
Standby Current-Max
0.000005 A
Supply Current-Max
0.11 mA
Terminal Finish
TIN LEAD
Toggle Bit
YES
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