S29GL512P10TAIV23 vs S29GL512P10FAIR22 feature comparison

S29GL512P10TAIV23 Cypress Semiconductor

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S29GL512P10FAIR22 Cypress Semiconductor

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP CYPRESS SEMICONDUCTOR CORP
Package Description HTSSOP, FBGA-64
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 100 ns 100 ns
JESD-30 Code R-PDSO-G56 R-PBGA-B64
Length 18.4 mm 13 mm
Memory Density 536870912 bit 536870912 bit
Memory IC Type FLASH FLASH
Memory Width 1 1
Number of Functions 1 1
Number of Terminals 56 64
Number of Words 536870912 words 536870912 words
Number of Words Code 512000000 512000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 512MX1 512MX1
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HTSSOP LBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.4 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 3 V
Supply Voltage-Nom (Vsup) 3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING BALL
Terminal Pitch 0.5 mm 1 mm
Terminal Position DUAL BOTTOM
Type NOR TYPE NOR TYPE
Width 14 mm 11 mm
Base Number Matches 2 2
Alternate Memory Width 8
Command User Interface YES
Common Flash Interface YES
Data Polling YES
JESD-609 Code e0
Moisture Sensitivity Level 3
Number of Sectors/Size 512
Package Equivalence Code BGA64,8X8,40
Page Size 8/16 words
Ready/Busy YES
Sector Size 128K
Standby Current-Max 0.000005 A
Supply Current-Max 0.11 mA
Terminal Finish TIN LEAD
Toggle Bit YES

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