S29GL512N90FAIR20 vs S29GL512N90FFIR13 feature comparison

S29GL512N90FAIR20 Spansion

Buy Now Datasheet

S29GL512N90FFIR13 Spansion

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SPANSION INC SPANSION INC
Part Package Code BGA BGA
Package Description 13 X 11 MM, 1 MM PITCH, FORTIFIED, BGA-64 LBGA,
Pin Count 64 64
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 90 ns 90 ns
Alternate Memory Width 8 8
JESD-30 Code R-PBGA-B64 R-PBGA-B64
JESD-609 Code e0 e1
Length 13 mm 13 mm
Memory Density 536870912 bit 536870912 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 64 64
Number of Words 33554432 words 33554432 words
Number of Words Code 32000000 32000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 32MX16 32MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 260
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.4 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 11 mm 11 mm
Base Number Matches 2 2
Time@Peak Reflow Temperature-Max (s) 40

Compare S29GL512N90FAIR20 with alternatives

Compare S29GL512N90FFIR13 with alternatives