S29GL512N11FAI12
vs
S29GL256N11FAIVH0
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SPANSION INC
|
SPANSION INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
13 X 11 MM, 1 MM PITCH, FORTIFIED, BGA-64
|
10 X 13 MM, 1 MM PITCH, FBGA-64
|
| Pin Count |
64
|
64
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Access Time-Max |
110 ns
|
110 ns
|
| Alternate Memory Width |
8
|
8
|
| JESD-30 Code |
R-PBGA-B64
|
R-PBGA-B64
|
| Length |
13 mm
|
13 mm
|
| Memory Density |
536870912 bit
|
536870912 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
64
|
64
|
| Number of Words |
33554432 words
|
16777216 words
|
| Number of Words Code |
32000000
|
16000000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
32MX16
|
16MX16
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LBGA
|
TBGA
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, THIN PROFILE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Programming Voltage |
3 V
|
3 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.4 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Type |
NOR TYPE
|
NOR TYPE
|
| Width |
11 mm
|
10 mm
|
| Base Number Matches |
1
|
1
|
| JESD-609 Code |
|
e0
|
| Output Characteristics |
|
3-STATE
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare S29GL512N11FAI12 with alternatives
Compare S29GL256N11FAIVH0 with alternatives