S29GL512N11FAI032
vs
S70GL01GN00FAI023
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
SPANSION INC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
BGA
Package Description
13 X 11 MM, 1 MM PITCH, FORTIFIED, BGA-64
Pin Count
64
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8542.32.00.51
Alternate Memory Width
8
8
Boot Block
BOTTOM/TOP
JESD-30 Code
R-PBGA-B64
S-PBGA-B64
JESD-609 Code
e0
Length
13 mm
Memory Density
536870912 bit
1073741824 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
Moisture Sensitivity Level
3
Number of Functions
1
Number of Terminals
64
64
Number of Words
33554432 words
67108864 words
Number of Words Code
32000000
64000000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
32MX16
64MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
BGA
Package Shape
RECTANGULAR
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
Supply Voltage-Nom (Vsup)
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Type
NOR TYPE
NOR TYPE
Width
11 mm
Base Number Matches
1
3
Access Time-Max
110 ns
Command User Interface
YES
Common Flash Interface
YES
Data Polling
YES
Number of Sectors/Size
512
Package Equivalence Code
BGA64,8X8,40
Page Size
8/16 words
Power Supplies
3/3.3 V
Ready/Busy
YES
Sector Size
128K
Standby Current-Max
0.000005 A
Supply Current-Max
0.09 mA
Toggle Bit
YES
Compare S29GL512N11FAI032 with alternatives