S29GL256S90DHI023 vs K8P2815UQC-JC4D0 feature comparison

S29GL256S90DHI023 Spansion

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K8P2815UQC-JC4D0 Samsung Semiconductor

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Rohs Code Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer SPANSION INC SAMSUNG SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description LEAD FREE, PACKAGE LBGA,
Pin Count 64 64
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.1.A EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 90 ns 70 ns
Command User Interface YES
Common Flash Interface YES
Data Polling YES
JESD-30 Code S-PBGA-B64 R-PBGA-B64
Length 9 mm 13 mm
Memory Density 268435456 bit 134217728 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Sectors/Size 256
Number of Terminals 64 64
Number of Words 16777216 words 8388608 words
Number of Words Code 16000000 8000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 16MX16 8MX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA64,8X8,40
Package Shape SQUARE RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Page Size 16 words
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 2.7 V 3 V
Qualification Status Not Qualified Not Qualified
Ready/Busy YES
Seated Height-Max 1.4 mm 1.3 mm
Sector Size 64K
Standby Current-Max 0.0001 A
Supply Current-Max 0.08 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Toggle Bit YES
Type NOR TYPE
Width 9 mm 11 mm
Base Number Matches 1 1
Additional Feature BOTTOM BOOT BLOCK, TOP BOOT BLOCK
Boot Block BOTTOM/TOP

Compare S29GL256S90DHI023 with alternatives

Compare K8P2815UQC-JC4D0 with alternatives