S29GL256S10DHIV20
vs
S29GL256S10FHAV10
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
SPANSION INC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
BGA
Package Description
LEAD FREE, PACKAGE
LBGA,
Pin Count
64
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.1.A
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
100 ns
100 ns
Command User Interface
YES
Common Flash Interface
YES
Data Polling
YES
JESD-30 Code
S-PBGA-B64
R-PBGA-B64
Length
9 mm
13 mm
Memory Density
268435456 bit
268435456 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Sectors/Size
256
Number of Terminals
64
64
Number of Words
16777216 words
16777216 words
Number of Words Code
16000000
16000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
16MX16
16MX16
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA64,8X8,40
BGA64,8X8,40
Package Shape
SQUARE
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Page Size
16 words
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Programming Voltage
2.7 V
3 V
Qualification Status
Not Qualified
Ready/Busy
YES
Seated Height-Max
1.4 mm
1.4 mm
Sector Size
64K
Standby Current-Max
0.0001 A
Supply Current-Max
0.08 mA
0.08 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Toggle Bit
YES
Type
NOR TYPE
NOR TYPE
Width
9 mm
11 mm
Base Number Matches
3
1
Date Of Intro
2017-05-03
Boot Block
BOTTOM/TOP
Screening Level
AEC-Q100
Compare S29GL256S10DHIV20 with alternatives
Compare S29GL256S10FHAV10 with alternatives