S29GL256P13TAIV23 vs AM29LV256MH108RFF feature comparison

S29GL256P13TAIV23 Cypress Semiconductor

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AM29LV256MH108RFF Spansion

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Rohs Code No Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP SPANSION INC
Package Description 14 X 20 MM, MO-142EC, TSOP-56 REVERSE, TSOP-56
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 110 ns 100 ns
Alternate Memory Width 8 8
JESD-30 Code R-PDSO-G56 R-PDSO-G56
JESD-609 Code e0 e3
Length 18.4 mm 18.4 mm
Memory Density 268435456 bit 268435456 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 56 56
Number of Words 16777216 words 16777216 words
Number of Words Code 16000000 16000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 16MX16 16MX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSOP1-R
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 3 V
Supply Voltage-Nom (Vsup) 3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Type NOR TYPE NOR TYPE
Width 14 mm 14 mm
Base Number Matches 1 1
Part Package Code TSOP
Pin Count 56
Boot Block BOTTOM/TOP

Compare S29GL256P13TAIV23 with alternatives

Compare AM29LV256MH108RFF with alternatives