S29GL256P11FFIR22 vs S29GL256P11FAIV22 feature comparison

S29GL256P11FFIR22 Spansion

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S29GL256P11FAIV22 AMD

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer SPANSION INC ADVANCED MICRO DEVICES INC
Part Package Code BGA
Package Description LBGA,
Pin Count 64
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 110 ns 110 ns
JESD-30 Code R-PBGA-B64 S-PBGA-B64
JESD-609 Code e1
Length 13 mm
Memory Density 268435456 bit 268435456 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 64 64
Number of Words 16777216 words 16777216 words
Number of Words Code 16000000 16000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 16MX16 16MX16
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA BGA
Package Shape RECTANGULAR SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Type NOR TYPE NOR TYPE
Width 11 mm
Base Number Matches 2 4
Alternate Memory Width 8
Command User Interface YES
Common Flash Interface YES
Data Polling YES
Number of Sectors/Size 256
Package Equivalence Code BGA64,8X8,40
Page Size 8/16 words
Ready/Busy YES
Sector Size 128K
Standby Current-Max 0.000005 A
Supply Current-Max 0.08 mA
Toggle Bit YES

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