S29GL256P11FACR12 vs S29GL256P11FACR22 feature comparison

S29GL256P11FACR12 Spansion

Buy Now Datasheet

S29GL256P11FACR22 Spansion

Buy Now Datasheet
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer SPANSION INC SPANSION INC
Part Package Code BGA BGA
Package Description LBGA, LBGA,
Pin Count 64 64
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 110 ns 110 ns
JESD-30 Code R-PBGA-B64 R-PBGA-B64
Length 13 mm 13 mm
Memory Density 268435456 bit 268435456 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 64 64
Number of Words 16777216 words 16777216 words
Number of Words Code 16000000 16000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 16MX16 16MX16
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.4 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Type NOR TYPE NOR TYPE
Width 11 mm 11 mm
Base Number Matches 2 2