S29GL256P10FAIV22
vs
S29GL256P10FAI012
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
SPANSION INC
ADVANCED MICRO DEVICES INC
Part Package Code
BGA
Package Description
LBGA,
Pin Count
64
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
100 ns
100 ns
JESD-30 Code
R-PBGA-B64
S-PBGA-B64
Length
13 mm
Memory Density
268435456 bit
268435456 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
64
64
Number of Words
16777216 words
16777216 words
Number of Words Code
16000000
16000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
16MX16
16MX16
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
BGA
Package Shape
RECTANGULAR
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
Supply Voltage-Nom (Vsup)
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Type
NOR TYPE
NOR TYPE
Width
11 mm
Base Number Matches
2
3
Rohs Code
Alternate Memory Width
8
Command User Interface
YES
Common Flash Interface
YES
Data Polling
YES
Number of Sectors/Size
256
Package Equivalence Code
BGA64,8X8,40
Page Size
8/16 words
Ready/Busy
YES
Sector Size
128K
Standby Current-Max
0.000005 A
Supply Current-Max
0.08 mA
Toggle Bit
YES