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S29GL256P10FAI010 vs S29GL256P10FFI010 feature comparison

S29GL256P10FAI010 AMD

Buy Now Datasheet

S29GL256P10FFI010 AMD

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer ADVANCED MICRO DEVICES INC ADVANCED MICRO DEVICES INC
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 100 ns 100 ns
Alternate Memory Width 8 8
Command User Interface YES YES
Common Flash Interface YES YES
Data Polling YES YES
JESD-30 Code S-PBGA-B64 S-PBGA-B64
Memory Density 268435456 bit 268435456 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Sectors/Size 256 256
Number of Terminals 64 64
Number of Words 16777216 words 16777216 words
Number of Words Code 16000000 16000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 16MX16 16MX16
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA64,8X8,40 BGA64,8X8,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Page Size 8/16 words 8/16 words
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Ready/Busy YES YES
Sector Size 128K 128K
Standby Current-Max 0.000005 A 0.000005 A
Supply Current-Max 0.08 mA 0.08 mA
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Toggle Bit YES YES
Type NOR TYPE NOR TYPE
Base Number Matches 4 4
Memory » Flash Memories
Memory » Flash Memories