S29GL256N11TAIV22 vs AM29LV256ML112EI feature comparison

S29GL256N11TAIV22 AMD

Buy Now Datasheet

AM29LV256ML112EI Spansion

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC SPANSION INC
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 110 ns 110 ns
Alternate Memory Width 8 8
Command User Interface YES
Common Flash Interface YES
Data Polling YES
JESD-30 Code R-PDSO-G56 R-PDSO-G56
JESD-609 Code e0 e0
Memory Density 268435456 bit 268435456 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Sectors/Size 256
Number of Terminals 56 56
Number of Words 16777216 words 16777216 words
Number of Words Code 16000000 16000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 16MX16 16MX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSOP1
Package Equivalence Code TSSOP56,.8,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE
Page Size 8/16 words
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Ready/Busy YES
Sector Size 128K
Standby Current-Max 0.000005 A
Supply Current-Max 0.09 mA
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Toggle Bit YES
Type NOR TYPE NOR TYPE
Base Number Matches 3 2
Part Package Code TSOP1
Package Description MO-142EC, TSOP-56
Pin Count 56
Length 18.4 mm
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Programming Voltage 3 V
Seated Height-Max 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3 V
Width 14 mm

Compare AM29LV256ML112EI with alternatives