S29GL256N11FFIVH0
vs
S29GL512N11FAIV10
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SPANSION INC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
BGA
Package Description
10 X 13 MM, 1 MM PITCH, LEAD FREE, FBGA-64
13 X 11 MM, FBGA-64
Pin Count
64
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
110 ns
110 ns
Alternate Memory Width
8
8
JESD-30 Code
R-PBGA-B64
R-PBGA-B64
Length
13 mm
13 mm
Memory Density
536870912 bit
536870912 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
64
64
Number of Words
16777216 words
33554432 words
Number of Words Code
16000000
32000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
16MX16
32MX16
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TBGA
LBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3 V
3 V
Qualification Status
Not Qualified
Seated Height-Max
1.2 mm
1.4 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Type
NOR TYPE
NOR TYPE
Width
10 mm
11 mm
Base Number Matches
1
3
Rohs Code
JESD-609 Code
e0
Moisture Sensitivity Level
3
Supply Current-Max
0.09 mA
Terminal Finish
Tin/Lead (Sn/Pb)
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