S29GL256N10TAI023 vs AM29LV256ML103FI feature comparison

S29GL256N10TAI023 AMD

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AM29LV256ML103FI AMD

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Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer ADVANCED MICRO DEVICES INC ADVANCED MICRO DEVICES INC
Package Description TSSOP, TSSOP56,.8,20 REVERSE, MO-142B, TSOP-56
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 100 ns 100 ns
Alternate Memory Width 8 8
Command User Interface YES YES
Common Flash Interface YES YES
Data Polling YES YES
JESD-30 Code R-PDSO-G56 R-PDSO-G56
JESD-609 Code e0 e0
Memory Density 268435456 bit 268435456 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Sectors/Size 256 512
Number of Terminals 56 56
Number of Words 16777216 words 16777216 words
Number of Words Code 16000000 16000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 16MX16 16MX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSOP1-R
Package Equivalence Code TSSOP56,.8,20 TSSOP56,.8,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE
Page Size 8/16 words 4/8 words
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Ready/Busy YES YES
Sector Size 128K 64K
Standby Current-Max 0.000005 A 0.000005 A
Supply Current-Max 0.09 mA 0.06 mA
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Toggle Bit YES YES
Type NOR TYPE NOR TYPE
Base Number Matches 3 2
Part Package Code TSOP1
Pin Count 56
Boot Block BOTTOM/TOP
Length 18.4 mm
Programming Voltage 3 V
Reverse Pinout YES
Seated Height-Max 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3 V
Width 14 mm

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