S29GL128S10TFIV20
vs
K8P2815UQC-JC4D0
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
SAMSUNG SEMICONDUCTOR INC
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
3A991.B.1.A
|
EAR99
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Access Time-Max |
100 ns
|
70 ns
|
Boot Block |
BOTTOM/TOP
|
BOTTOM/TOP
|
Command User Interface |
YES
|
|
Common Flash Interface |
YES
|
|
Data Polling |
YES
|
|
JESD-30 Code |
R-PDSO-G56
|
R-PBGA-B64
|
JESD-609 Code |
e3
|
|
Length |
18.4 mm
|
13 mm
|
Memory Density |
134217728 bit
|
134217728 bit
|
Memory IC Type |
FLASH
|
FLASH
|
Memory Width |
8
|
16
|
Moisture Sensitivity Level |
3
|
|
Number of Functions |
1
|
1
|
Number of Sectors/Size |
128
|
|
Number of Terminals |
56
|
64
|
Number of Words |
16777216 words
|
8388608 words
|
Number of Words Code |
16000000
|
8000000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
16MX8
|
8MX16
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
LBGA
|
Package Equivalence Code |
TSSOP56,.8,20
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
GRID ARRAY, LOW PROFILE
|
Page Size |
16 words
|
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
260
|
|
Programming Voltage |
3 V
|
3 V
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Ready/Busy |
YES
|
|
Seated Height-Max |
1.2 mm
|
1.3 mm
|
Sector Size |
64K
|
|
Standby Current-Max |
0.0001 A
|
|
Supply Current-Max |
0.08 mA
|
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
Matte Tin (Sn)
|
|
Terminal Form |
GULL WING
|
BALL
|
Terminal Pitch |
0.5 mm
|
1 mm
|
Terminal Position |
DUAL
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Toggle Bit |
YES
|
|
Type |
NOR TYPE
|
|
Width |
14 mm
|
11 mm
|
Base Number Matches |
3
|
1
|
Part Package Code |
|
BGA
|
Package Description |
|
LBGA,
|
Pin Count |
|
64
|
Additional Feature |
|
BOTTOM BOOT BLOCK, TOP BOOT BLOCK
|
|
|
|
Compare S29GL128S10TFIV20 with alternatives
Compare K8P2815UQC-JC4D0 with alternatives