S29GL128S10TFB013
vs
S29GL128S10TFV010
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
INFINEON TECHNOLOGIES AG
|
SPANSION INC
|
| Reach Compliance Code |
compliant
|
compliant
|
| Samacsys Manufacturer |
Infineon
|
|
| Access Time-Max |
100 ns
|
100 ns
|
| Additional Feature |
20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES
|
|
| Alternate Memory Width |
1
|
|
| Boot Block |
BOTTOM/TOP
|
|
| Command User Interface |
YES
|
YES
|
| Common Flash Interface |
YES
|
YES
|
| Data Polling |
YES
|
YES
|
| Data Retention Time-Min |
2
|
|
| Endurance |
100000 Write/Erase Cycles
|
|
| JESD-30 Code |
R-PDSO-G56
|
S-PBGA-B64
|
| JESD-609 Code |
e3
|
|
| Length |
18.4 mm
|
|
| Memory Density |
134217728 bit
|
134217728 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
8
|
16
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
|
| Number of Sectors/Size |
128
|
128
|
| Number of Terminals |
56
|
64
|
| Number of Words |
16777216 words
|
8388608 words
|
| Number of Words Code |
16000000
|
8000000
|
| Operating Mode |
ASYNCHRONOUS
|
|
| Operating Temperature-Max |
105 °C
|
105 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
16MX8
|
8MX16
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
BGA
|
| Package Equivalence Code |
TSSOP56,.8,20
|
BGA64,8X8,40
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
GRID ARRAY
|
| Page Size |
32 words
|
16 words
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Programming Voltage |
3 V
|
2.7 V
|
| Ready/Busy |
YES
|
YES
|
| Screening Level |
AEC-Q100; TS 16949
|
|
| Seated Height-Max |
1.2 mm
|
|
| Sector Size |
128K
|
64K
|
| Standby Current-Max |
0.0002 A
|
0.0002 A
|
| Supply Current-Max |
0.1 mA
|
0.06 mA
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
|
| Supply Voltage-Nom (Vsup) |
3 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
Matte Tin (Sn)
|
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.5 mm
|
1 mm
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Toggle Bit |
YES
|
YES
|
| Type |
NAND TYPE
|
NOR TYPE
|
| Width |
14 mm
|
|
| Base Number Matches |
2
|
3
|
| ECCN Code |
|
3A991.B.1.A
|
| HTS Code |
|
8542.32.00.51
|
| Qualification Status |
|
Not Qualified
|
| Temperature Grade |
|
INDUSTRIAL
|
|
|
|
Compare S29GL128S10TFB013 with alternatives