S29GL128P13TFIV20
vs
S29GL128N11TFI012
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
SPANSION INC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
TSOP1
Package Description
14 X 20 MM, LEAD FREE, MO-142EC, TSOP-56
LEAD FREE, MO-142EC, TSOP-56
Pin Count
56
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
110 ns
110 ns
Alternate Memory Width
8
8
JESD-30 Code
R-PDSO-G56
R-PDSO-G56
JESD-609 Code
e3
Length
18.4 mm
18.4 mm
Memory Density
134217728 bit
134217728 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
56
56
Number of Words
8388608 words
8388608 words
Number of Words Code
8000000
8000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
8MX16
8MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3 V
3 V
Qualification Status
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Type
NOR TYPE
NOR TYPE
Width
14 mm
14 mm
Base Number Matches
2
3
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
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