S29GL128P10FAIV20 vs W29GL128CL1B feature comparison

S29GL128P10FAIV20 Spansion

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W29GL128CL1B Winbond Electronics Corp

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer SPANSION INC WINBOND ELECTRONICS CORP
Part Package Code BGA BGA
Package Description LBGA, LBGA, BGA64,8X8,40
Pin Count 64 64
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 100 ns 100 ns
JESD-30 Code R-PBGA-B64 R-PBGA-B64
Length 13 mm 13 mm
Memory Density 134217728 bit 134217728 bit
Memory IC Type FLASH FLASH
Memory Width 1 1
Number of Functions 1 1
Number of Terminals 64 64
Number of Words 134217728 words 134217728 words
Number of Words Code 128000000 128000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 128MX1 128MX1
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.4 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Type NOR TYPE NOR TYPE
Width 11 mm 11 mm
Base Number Matches 2 1
Rohs Code Yes
Additional Feature IT ALSO OPERATES AT 3 V TO 3.6 V
Alternate Memory Width 8
Command User Interface YES
Common Flash Interface YES
Data Polling YES
Number of Sectors/Size 128
Package Equivalence Code BGA64,8X8,40
Page Size 8/16 words
Ready/Busy YES
Sector Size 128K
Standby Current-Max 0.000005 A
Supply Current-Max 0.055 mA
Toggle Bit YES

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