S29GL064N90FFI043
vs
S29GL064M90FAIR32
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Ihs Manufacturer
SPANSION INC
Part Package Code
BGA
Package Description
13 X 11 MM, FORTIFIED, BGA-64
Pin Count
64
Reach Compliance Code
not_compliant
ECCN Code
EAR99
HTS Code
8542.32.00.51
Access Time-Max
90 ns
Additional Feature
TOP BOOT BLOCK
Alternate Memory Width
8
Boot Block
TOP
Command User Interface
YES
Common Flash Interface
YES
Data Polling
YES
JESD-30 Code
R-PBGA-B64
JESD-609 Code
e0
Length
13 mm
Memory Density
67108864 bit
Memory IC Type
FLASH
Memory Width
16
Moisture Sensitivity Level
3
Number of Functions
1
Number of Sectors/Size
8,127
Number of Terminals
64
Number of Words
4194304 words
Number of Words Code
4000000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
4MX16
Package Body Material
PLASTIC/EPOXY
Package Code
LBGA
Package Equivalence Code
BGA64,8X8,40
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
Page Size
4/8 words
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
260
Programming Voltage
3 V
Qualification Status
Not Qualified
Ready/Busy
YES
Seated Height-Max
1.4 mm
Sector Size
8K,64K
Standby Current-Max
0.000005 A
Supply Current-Max
0.06 mA
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
3.3 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Toggle Bit
YES
Type
NOR TYPE
Width
11 mm
Base Number Matches
1
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