S29GL064N90FAI10
vs
M29W640GL90ZS3E
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
SPANSION INC
MICRON TECHNOLOGY INC
Part Package Code
BGA
Package Description
13 X 11 MM, FBGA-64
,
Pin Count
64
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
90 ns
Alternate Memory Width
8
JESD-30 Code
R-PBGA-B64
JESD-609 Code
e0
Length
13 mm
Memory Density
67108864 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
Moisture Sensitivity Level
3
Number of Functions
1
Number of Terminals
64
Number of Words
4194304 words
Number of Words Code
4000000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
4MX16
Package Body Material
PLASTIC/EPOXY
Package Code
LBGA
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
Programming Voltage
3 V
3 V
Qualification Status
Not Qualified
Seated Height-Max
1.4 mm
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
Supply Voltage-Nom (Vsup)
3 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Type
NOR TYPE
NOR TYPE
Width
11 mm
Base Number Matches
2
2
Compare S29GL064N90FAI10 with alternatives
Compare M29W640GL90ZS3E with alternatives