S29GL064M11BCIR12
vs
AM29BDS640GT73WSI
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
SPANSION INC
ADVANCED MICRO DEVICES INC
Part Package Code
BGA
BGA
Package Description
TFBGA,
11 X 12 MM, FBGA-80
Pin Count
80
80
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
110 ns
14 ns
Alternate Memory Width
8
JESD-30 Code
R-PBGA-B80
R-PBGA-B80
JESD-609 Code
e1
e0
Length
11 mm
11.95 mm
Memory Density
67108864 bit
67108864 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
80
80
Number of Words
4194304 words
4194304 words
Number of Words Code
4000000
4000000
Operating Mode
ASYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
4MX16
4MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
Programming Voltage
3 V
1.8 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
1.95 V
Supply Voltage-Min (Vsup)
3 V
1.65 V
Supply Voltage-Nom (Vsup)
3.3 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
Tin/Lead (Sn/Pb)
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Width
7 mm
10.95 mm
Base Number Matches
2
2
Boot Block
TOP
Command User Interface
YES
Common Flash Interface
YES
Data Polling
YES
Number of Sectors/Size
8,126
Package Equivalence Code
BGA80,8X12,32
Ready/Busy
YES
Sector Size
8K,32K
Standby Current-Max
0.00001 A
Supply Current-Max
0.06 mA
Toggle Bit
YES
Type
NOR TYPE
Compare S29GL064M11BCIR12 with alternatives
Compare AM29BDS640GT73WSI with alternatives